Are you minimizing waste during handling and unwinding during wound-roll packaging?
Download this paper! Historically, wound-roll models have been used to predict stress levels which develop within winding and wound rolls. To gain maximum benefit from these models, stresses must be incorporated into defect or failure models. In this paper deals with the following:
- Prediction of wound roll dishing in narrow rolls where not lap-to-lap slippage occurs.
- A dishing model is presented which predicts the dishing which develops within a winding roll due to the presence of thickness nonuniformity and inplane or radial stress arising from the wound-on tension stress.
- A model is presented for computing the initial nonstraight profile of the wound roll.